GlobalFoundries, Inc.
Head Office: USA
Globally operating world-leading foundry
GlobalFoundries has manufacturing facilities in the United States, Germany, Singapore and France. With its unique technologies, it is the leading specialty foundry. GlobalFoundries's unique technologies include cutting-edge FinFET, high-voltage-resistant BCD process, silicon-germanium (SiGe), high-frequency RF-SOI, FD-SOI and silicon photonics technologies.
As a GlobalFoundries platinum partner, SHINDEN HIGHTEX's experienced staff members provide technical support and foundry, shuttle and turn-key services.
Key Products
Foundry Service
- Feature Rich CMOS
- BCD/BCDLite
- FinFET
- RF-SOI
- FD-SOI
- Silicon Photonics
Shuttle Service
Prototypes are provided using the GlobalFoundries shuttle service, GlobalShuttle.
Turn-Key Service
To accommodate the forms of services that are requested by customers, the company leverages partner companies to deliver optimal devices using turn-key services (for chip design, wafer manufacturing, packages and testing).
Global production bases
When calculating capacity, 200 mm wafers are converted to their 300 mm equivalent.
*1 Partnership with STMicroelectronics
Take a virtual tour of the fab!
※Malta, NY, USA (No sound)
Distinctive, rich technology platform
-
- The technology is a combination of power management, high voltage resistance and embedded memory technologies.
- The company has shipped more than 3 billion high-end audio amplifier units (BCDLite).
It has shipped more than 150 thousand DDIC wafers.
-
- This is a high-performance high-power-efficiency system-on-a-chip (SoC).
- The company is one of three foundries in the world able to produce FinFETs. Additionally, unique features are added during the FinFET manufacturing process.
-
- Makes high-performance low-power-consumption applications possible.
- Two of the top three companies designing front-end modules for 5G mmWave have chosen GlobalFoundries.
-
- This achieves low power consumption, low noise, low latency and high frequency.
- The company is the first in the world to mass produce RFSOI for 300-millimeter wafers.
-
- Characteristics of this technology include its power amplification and ultra-high frequency.
- The SiGe BiCMOS process has the highest Fmax in the industry for processes provided by foundries handling mass production. The Fmax of the process currently in mass production is 400 GHz, and the company has a roadmap for increasing performance to 1 THz.
-
- Higher data rates are achievable with very high power efficiency.
- Its power efficiency in long-distance communication is five to ten times greater than electrical connections.
