LB Semicon Inc.
Head Office: South Korea
Semiconductor assembly and testing process company providing gold bump, wafer-level CSP and other bumping services, probe tests and back-end one-stop solutions
LB Semicon is a bumping company established in South Korea in 2000. It was listed on Korea's KOSDAQ stock market in 2011.
LB Semicon provides full turn-key services for LCD driver ICs up to the back-end assembly process, ranging from 200- or 300-millimeter wafer bumping and probe testing to backside lamination, back grinding, laser marking, dicing, picking and placing onto trays and AVI.
In addition to display driver ICs (DDIs), LB Semicon provides all kinds of flip chip bumping services, including the solder bumping processes used for CMOS image sensors, PMICs and other applications, copper pillar bumping and wafer-level CSPs.
The company is also able to provide complete one-stop solutions covering the entire back-end process, from testing to the taping of wafer-level packages. (LB Semicon responds to new requests from customers quickly and efficiently.)
Key Products
Bumping Services
- Gold Bump
- Solder Bump
- Cu Pillar Bump
- RDL (Re Distribution Layer)
- Thick Cu
- WLCSP
Probe Test
- Display Driver IC
- PMIC
- CIS, CCD
- RE-CON
Back-End Services
- Back Grinding
- Laser Marking
- Dicing Saw
- Auto Visual Inspection
- Pick & Place, Tape & Reel
- Packing
Bumping Services
- Gold Bump
- Solder Bump
- Cu Pillar Bump
- RDL (Re Distribution Layer)
- Thick Cu
- WLCSP
Probe Test
- Display Driver IC
- PMIC
- CIS, CCD
- RE-CON
Back-End Services
- Back Grinding
- Laser Marking
- Dicing Saw
- Auto Visual Inspection
- Pick & Place, Tape & Reel
- Packing
Example bumping services and applications
| Bump | Wafer Size | Process | Characteristic | Market Application |
|---|---|---|---|---|
| Au | 8" & 12" |  |
COF | TV, Monitor, Notebook DIC |
 |
COG | Mobile, Tablet, Automotive DIC | ||
 |
Cu-Ni-Au Bump (8-3-1um) |
DIC / Sensor | ||
 |
RDL | Premium DRAM | ||
| WLCSP |  |
Solder ball | PMIC, DMB RF & BB SoC, Transceiver | |
| Solder |  |
Cu Pillar bump | BB & AP processor, Power Amplifiers, NAND Fash, WiFi module | |
 |
Solder bump | AP, SoC, PMIC | ||
| RDL |  |
Cu RDL | Sensor | |
 |
Cu/Ni/Au RDL | PMIC, DRAM, Flash Memory |
Back-end services and specifications
| Service | Process | Coverage (Both 8" & 12") |
|---|---|---|
| Back Grinding |  |
|
| Laser Marking |  |
|
| Dicing Saw |  |
|
| Auto Visual Inspection |  |
|
| Packing |  |
|
Quality assurance
For LB Semicon, the first priority is implementing quality control and environmental measures to create value for customers and ensure full customer satisfaction. The company maintains its quality management system which conforms to the ISO 9001 and works to adhere to ISO/TS 16949 standards, and it is committed to delivering the high quality requested by customers.
